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Staff – Ñîòðóäíèêè
Books – Ìîíîãðàôèè
Papers – Ñòàòüè
Projects – Ïðîåêòû
History – Èñòîðèÿ
Applications – Ïðèêëàäíûå ðàáîòû
Conferences – Êîíôåðåíöèè
Most important results – Âàæíåéøèå ðåçóëüòàòû
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Papers -
2001 - Ñòàòüè
1. B. Straumal, N. E. Sluchanko, W. Gust
Influence of the grain boundary phase transitions on the properties of Cu–Bi
polycrystals PDF
Def. Diff. Forum 188-190 (2001) 185–194
2. B. Straumal, S. I. Prokofjev, L.-S. Chang, N. E. Sluchanko,
B. Baretzky, W. Gust, E. Mittemeijer
Grain boundary phase transitions in the Cu–Bi system PDF
Def. Diff. Forum 194-199 (2001) 1343–1348
3. J. Schölhammer, B. Baretzky,
W. Gust, E. Mittemeijer, B. Straumal
Grain boundary grooving as an indicator of grain boundary phase
transformations PDF
Interf. Sci.
9 (2001) 43–53
4. B.B. Straumal, N. F. Vershinin, M. Friesel, T. V. Ischenko, S. A. Polyakov, W.
Gust
Ionic nitriding of austenitic and ferritic steel with the aid of a high aperture Hall
current accelerator PDF
Def. Diff. Forum 194-199 (2001) 1457–1462
5. A. Cantarero, C. Ferrer, A. Sanchez, B. Straumal,
N. Vershinin, E. Rabkin PDF
Recubrimientos decorativos
de Ti, TiN y TiO2 sobre
vidrio, depositados en vacúo mediante pulverización por arco electrico. (Vacuum arc
deposited Ti, TiN and TiO2 decorative
coatings on glass)
Bol. Soc. Esp. Ceram.
Vidrio 40, No. 2 (2001) 138–142 (in
Spanish)
6. B. B. Straumal, N. F. Vershinin, A. Cantarero Saez, M. Friesel, P. Zieba, W. Gust
Vacuum arc deposition of protective layers on glass and polymer substrates PDF
Thin Solid Films 383 (2001) 224–226
7. B. B. Straumal, N. F. Vershinin, S. A. Polyakov, P.
V. Orlova, M. Friesel, W.
Gust PDF
Ion cleaning and nitriding using a high aperture
Hall current accelerator
In: Progress in plasma processing of materials 2001, ed. P. Fauchais, Begell House, New
York (2001) pp. 573–578.
8. V. G. Sursaeva, S. G. Protasova, B. B. Straumal
Meyer-Neldel rule for kinetic properties of grain
and interphase boundaries PDF
Def. Diff. Forum 192-193 (2001) 15–26
9. B. B. Straumal, N. Vershinin, E. Rabkin, R. Kroeger, R. Dimitriou, W. Gust
Vacuum arc deposited nanostructured Ti-coatings PDF
In: Progress in plasma processing of materials 2001, ed. P. Fauchais, Begell House, New
York (2001) pp. 559–564.
10. P. Fogarassy,
F. Rotaru, N. Markocsan, B.B. Straumal
Finite element analysis of the bondcoat influence
on residual stress during the plasma thermal spraying of partially stabilised zirconia PDF
In: Pulverizarea termică,
D. Böhme et
al. (eds.) ISIM, Timişoara, Romania (2000) 83–92
11. B. B. Straumal,
P. Zięba, W. Gust
Grain boundary phase transitions and phase diagrams PDF
Int. J. Inorgan. Mater. 3 (2001)
1113–1115
12. B. B. Straumal,
N. F. Vershinin, S. A. Polyakov,
M. Friesel, P. Fogarassy
Preparation of large area substrates using high aperture Hall current
accelerator. In: Pulverizarea
termică, D. Böhme
et al. (eds.) PDF
ISIM, Timişoara, Romania (2000) 193–199
13. M. D. Baro, Yu. R. Kolobov, I. A. Ovid’ko, H.-E. Schaefer,
B. B. Straumal, R. Z. Valiev, I. V. Alexandrov, M. Ivanov, K. Reimann, A. B.
Reizis, S. Surinash, A. P. Zhilyaev
Diffusion and related phenomena in bulk nanostructured materials PDF
Rev. Adv. Mater.
Sci. 2 (2001) 1–43
14. B. B. Straumal,
S. A. Polyakov, E. Bischoff, W. Gust, E. J. Mittemeijer
Faceting of S3 and S9 grain boundaries in copper PDF
Interface Sci 9 (2001) 287–292
15. Y. Estrin, G.
Gottstein, E.
Rabkin, L. S. Shvindlerman
Grain growth in thin metallic films
Acta mater. 49 (2001) 673–681 PDF
16. V.G. Sursaeva,
G. Gottstein, and L.S. Shvindlerman
Mobility of grain boundaries and grain boundary systems with triple junction:
a direct comparison
In: „Recrystallization and Grain Growth“,
Eds. G. Gottstein and D.A. Molodov, Springer-Verlag, Vol. I, 2001, pp. 455–462
17. P.R. Rios, G. Gottstein, L.S. Shvindlerman
Application of the thermodynamic theory of irreversible processes to normal
grain growth
Scripta mater. 44 (2001)
893–897 PDF
18. L.S. Shvindlerman,
G. Gottstein
Grain boundary and triple junction migration
Mater. Sci. Eng. A 302 (2001) 141–150 PDF
19. S. G. Protasova,
G. Gottstein, D. A. Molodov, V. G. Sursaeva, L. S. Shvindlerman
Triple junction motion in aluminum tricrystals
Acta Mater. 49 (2001)
2519–2525 PDF
20. G. Gottstein, D. A. Molodov,
L. S. Shvindlerman, M. Winning
Grain boundary dynamics: a novel tool for microstructure control
Interface Sci. 9 (2001) 297–306 PDF
21. S. Protasova,
V. Sursaeva
Triple junction effect on the grain growth in nanostructured
materials
Interface Sci. 9 (2001) 307–311 PDF
22. S. G. Protasova,
V. G. Sursaeva
The kinetic parameters of triple junction motion in aluminium
Def. Diff. Forum 194-199 (2001) 1259–1264 PDF
23. L. S. Shvindlerman,
G. Gottstein, D. A. Molodov , V. G. Sursaeva
Triple junction motion in metals
In: „Recrystallization and Grain Growth“,
Eds. G. Gottstein and D.A. Molodov, Springer-Verlag, Vol. I, 2001, pp. 177–192
24. V. G. Sursaeva,
S. G. Protasova
Compensation effect for kinetic properties of triple junctions
Interface Sci. 9 (2001) 319–323 PDF
25. D. A. Molodov,
G. Gottstein, S. G. Protasova, V. G. Sursaeva, L. S. Shvindlerman
Motion of grain boundaries with triple junctions in aluminium
In: „Recrystallization and Grain Growth“,
Eds. G. Gottstein and D.A. Molodov, Springer-Verlag, Vol. I, 2001, pp.441–448
26. S. Protasova,
V. Sursaeva
Dimensional effect on the normal grain growth in nanostructured
aluminium
In: „Recrystallization and Grain Growth“,
Eds. G. Gottstein and D.A. Molodov, Springer-Verlag, Vol. I, 2001, pp. 557–562
27. V. G. Sursaeva,
S. G. Protasova
Investigation of two-dimensional grain growth in Al
In: „Recrystallization and Grain Growth“,
Eds. G. Gottstein and D.A. Molodov, Springer-Verlag, Vol. I, 2001, pp. 327–332
28. A.U.Tuflin, V.G.Sursaeva, U. Czubayko
The kinetics and thermodynamics of deformation twin grain boundaries in Zn
Def. Diff. Forum 194-199 (2001) 1253–1258 PDF
29. S. Prokofiev
Diffusion of Au along <110> symmetrical tilt
boundaries in copper: Grain boundary roughening?
Def. Diff. Forum 194-199 (2001) 1337–1342 PDF
30. S. Prokofiev
Effect of diffusant segregation on the misorientation dependences of the characteristics of grain
boundary diffusion: Ni and Au in copper.
Def. Diff. Forum 194-199 (2001) 1141–1146 PDF
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